Substrate - germanium wafer
1. Diameter: 2~8 inches
2. It is mainly used in the manufacture of infrared windows and semiconductor devices.
3. It is dark blue in powder form, crystallized, silver-white and brittle metal. Density 5.35 g/cm3. The melting point is 937.4°C. The boiling point is 2830°C. Valence +2 and +4. Not oxidized in air. Its fine powder can burn in chlorine or bromine.