TSV THROUGH-HOLE DEVICES

Process introduction:

TSV (Through-Silicon Via) technology is an advanced technology for chip stack interconnection in three-dimensional integrated circuits. It can achieve high-density stacking of chips in three dimensions, shorten interconnect lines, reduce overall size, and significantly increase chip speed and reduce power consumption. In-situ chips master the latest TSV technology to meet customers' individual needs.

Technical applications:

TSV technology is widely used in MEMS devices, memories, image sensors, power amplifiers, biological application equipment and various mobile phone chips.

Process capabilities:

Opening size: 30-100um

Aspect ratio: 5:1

Plating materials: copper, gold

Through hole status: hollow hole