HIGH PRECISION SILICON-BASED MASK PLATE

Process introduction:

High-precision silicon-based masks form fine patterns on silicon substrates through micro-nano etching technology and are used for electrical and optoelectronic research on two-dimensional materials. In-situ chips use this mask to deposit metal on thin film materials to create precise metal electrodes.

Product application:

Researchers use silicon-based masks to prepare high-precision two-dimensional material metal electrodes to conduct research on electrical and optoelectronic properties.

Process capabilities:

Minimum line width: 2um

The thinnest non-hollow pattern: 200um

The thinnest hollow pattern: 20um