SILICON NITRIDE THIN FILM DEVICES

Process Introduction:

Silicon nitride thin film is a high-performance ceramic material with high hardness, corrosion resistance, high temperature resistance, chemical stability, and good electrical insulation. These characteristics make it very useful in the fields of microelectronics and optoelectronics. Mainly serving structural analysis or transmission imaging experiments such as synchrotron radiation X-ray, soft X-ray, ultraviolet or extreme ultraviolet, TEM, EDX observation, etc.

Process capability:

Opening size: 30-100um

Depth to width ratio: 5:1

Electroplating materials: copper, gold

Through hole status: hollow hole